cystech electronics corp. spec. no. : c812m3-a issued date : 2011.02.17 revised date : page no. : 1/7 BTB1188AM3 cystek product specification low vcesat pnp epitaxial planar transistor bv ceo -40v i c -2a r cesat(typ) 0.22 BTB1188AM3 features ? low v ce (sat), v ce (sat)=-0.65 v (typical), at i c / i b = -3a / -0.1a ? excellent current gain characteristics ? complementary to btd1766am3 ? pb-free lead plating package symbol outline BTB1188AM3 sot-89 b base c collector e emitter b c e absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo -50 v collector-emitter voltage v ceo -40 v emitter-base voltage v ebo -6 v collector current (dc) i c -2 a collector current (pulse) i cp -4 (note 1) a power dissipation pd 0.6 w power dissipation pd 2 (note 2) w esd susceptibility 8000 (note 3 ) v operating junction and storage temp erature range tj ; tstg -55~+150 c
cystech electronics corp. spec. no. : c812m3-a issued date : 2011.02.17 revised date : page no. : 2/7 BTB1188AM3 cystek product specification thermal data parameter symbol value unit thermal resistance, junction-to-case, max r th,j-c 30.4 c/w thermal resistance, junction-to-ambient, max r th,j-a 208 c/w thermal resistance, junction-to-ambient, max (note 2) r th,j-a 125 c/w note : 1. single pulse , pw=10ms 2. when mounting on a 40 40 0.7 mm ceramic board. 3. human body model, 1.5k in series with 100pf characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo -50 - - v i c =-50 a, i e =0 bv ceo -40 - - v i c =-1ma, i b =0 bv ebo -6 - - v i e =-50 a, i c =0 i cbo - - -100 na v cb =-50v, i e =0 i ebo - - -100 na v eb =-6v, i c =0 *v ce(sat) - -0.2 -0.4 v i c =-700ma, i b =-35ma *v ce(sat) - -0.45 -0.8 v i c =-2a, i b =-0.2a *v ce(sat) - -0.65 -1 v i c =-3a, i b =-0.1a *h fe 180 - 560 - v ce =-3v, i c =-0.5a f t - 180 - mhz v ce =-5v, i c =-0.1a, f=100mhz cob - 20 - pf v cb =-10v, f =1mhz *pulse test : pulse width 380 s, duty cycle 2% classification of hfe rank r s range 180~390 270~560 ordering information device package shipping BTB1188AM3 sot-89 (pb-free lead plating) 1000 pcs / tape & reel
cystech electronics corp. spec. no. : c812m3-a issued date : 2011.02.17 revised date : page no. : 3/7 BTB1188AM3 cystek product specification typical characteristics emitter grounded output characteristics 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) 200u a 300u a 400u a 500ua 1ma ib=100ua emitter grounded output characteristics 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) 1ma 1.5m a 2ma 2.5ma 5ma ib=500ua emitter grounded output characteristics 0 1 2 3 4 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=2ma 4ma 6ma 8ma 10ma 20ma emitter grounded output characteristics 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=5ma 10ma 15ma 20ma 50ma current gain vs collector current 10 100 1000 1 10 100 1000 10000 collector current---ic(ma) current gain---hfe vce=1v vce=2v vce=5v saturation voltage vs collector current 1 10 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) vcesat@ic=50ib vcesat=10ib vcesat=20ib
cystech electronics corp. spec. no. : c812m3-a issued date : 2011.02.17 revised date : page no. : 4/7 BTB1188AM3 cystek product specification typical characteristics(cont.) saturation voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) vbesat@ic=10ib on voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) on voltage---(mv) vbeon@vce=2v capacitance vs reverse-biased voltage 10 100 1000 0.1 1 10 100 reverse-biased voltage---vr(v) capacitance---(pf) cib cob power derating curves 0 0.5 1 1.5 2 2.5 0 50 100 150 200 ambient temperature---ta() power dissipation---pd(w) see note 2 on page 1 transition frequency vs collector current 10 100 1000 1 10 100 1000 collector current---ic(ma) transition frequency---ft(mhz) vce=5v
cystech electronics corp. spec. no. : c812m3-a issued date : 2011.02.17 revised date : page no. : 5/7 BTB1188AM3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c812m3-a issued date : 2011.02.17 revised date : page no. : 6/7 BTB1188AM3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c812m3-a issued date : 2011.02.17 revised date : page no. : 7/7 BTB1188AM3 cystek product specification sot-89 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1732 0.1811 4.40 4.60 f 0.0583 0.0598 1.48 1.527 b 0.1594 0.1673 4.05 4.25 g 0. 1165 0.1197 2.96 3.04 c 0.0591 0.0663 1.50 1.70 h 0.0551 0.0630 1.40 1.60 d 0.0945 0.1024 2.40 2.60 i 0.0138 0.0161 0.35 0.41 e marking: e f g c b a i d h 3 2 1 3-lead sot-89 plastic surface mounted package cystek package code: m3 style: pin 1. base 2. collector 3. emitter product code hfe rank month code: 1~9, a,b,c wafer code 0.01417 0.0201 0.36 0.51 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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